 温馨提示:图片仅供参考，请查阅数据手册 | 22.0μF ±20% 10.0V CA45H-C010M226AT 国产 | 非PIN TO PIN | 相似度99% | Xiangyi(湘怡中元) | Epoxy molded encapsulation, Chip, Easy for integration, Polarized | - | Epoxy molded encapsulation, Chip, Easy for integration, Polarized - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 330.0μF ±20% 10.0V CA-10V330μF-M 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Metal case encapsulation, Hermitically-sealed, Tubular, Axial-lead, With Insulation Sleeve,With Insulation Sleeve,Heteropolarity | - | Metal case encapsulation, Hermitically-sealed, Tubular, Axial-lead, With Insulation Sleeve,With Insulation Sleeve,Heteropolarity - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 47.0μF ±20% 10V GCA30-10V47μF-M 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Silver case encapsulation , Epoxy end-filled,Tubular, Axial-lead,With insulation sleeve, Heteropolarity | - | Silver case encapsulation , Epoxy end-filled,Tubular, Axial-lead,With insulation sleeve, Heteropolarity - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 3.3μF ±20% 50.0V CA45H-D050M335AT 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Epoxy molded encapsulation, Chip, Easy for integration, Polarized | - | Epoxy molded encapsulation, Chip, Easy for integration, Polarized - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 150.0μF ±20% 10.0V CA45H-E010M157AT 国产 | 非PIN TO PIN | 相似度99% | Xiangyi(湘怡中元) | Epoxy molded encapsulation, Chip, Easy for integration, Polarized | - | Epoxy molded encapsulation, Chip, Easy for integration, Polarized - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 10.0μF ±20% 25.0V CA45H-C025M106AT 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Epoxy molded encapsulation, Chip, Easy for integration, Polarized | - | Epoxy molded encapsulation, Chip, Easy for integration, Polarized - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 330.0μF ±20% 10V GCA35-10V330μF-M 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | 银外壳封装、气密封、圆柱形、轴向引出、外套绝缘套管、有极性 | - | 银外壳封装、气密封、圆柱形、轴向引出、外套绝缘套管、有极性 - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 22.0μF ±20% 10.0V CA-10V22μF-M 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Metal case encapsulation, Hermitically-sealed, Tubular, Axial-lead, With Insulation Sleeve,With Insulation Sleeve,Heteropolarity | - | Metal case encapsulation, Hermitically-sealed, Tubular, Axial-lead, With Insulation Sleeve,With Insulation Sleeve,Heteropolarity - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 47.0μF ±20% 6.3V CA45H-D6R3M476AT 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Epoxy molded encapsulation, Chip, Easy for integration, Polarized | - | Epoxy molded encapsulation, Chip, Easy for integration, Polarized - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 4.7μF ±20% 10.0V CA45H-A010M475AT 国产 | 非PIN TO PIN | 相似度99% | Xiangyi(湘怡中元) | Epoxy molded encapsulation, Chip, Easy for integration, Polarized | - | Epoxy molded encapsulation, Chip, Easy for integration, Polarized - | - | 0 pcs | - | - | 0 pcs - - | | |
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