 温馨提示:图片仅供参考，请查阅数据手册 | 2.2μF ±20% 25.0V CA45H-B025M225AT 国产 | 非PIN TO PIN | 相似度99% | Xiangyi(湘怡中元) | Epoxy molded encapsulation, Chip, Easy for integration, Polarized | - | Epoxy molded encapsulation, Chip, Easy for integration, Polarized - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 1.5μF ±20% 50.0V CA45H-C050M155AT 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Epoxy molded encapsulation, Chip, Easy for integration, Polarized | - | Epoxy molded encapsulation, Chip, Easy for integration, Polarized - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 22.0μF ±20% 10.0V CA45H-C010M226AT 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Epoxy molded encapsulation, Chip, Easy for integration, Polarized | - | Epoxy molded encapsulation, Chip, Easy for integration, Polarized - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 2.2μF ±20% 10.0V CA45H-A010M225AT 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Epoxy molded encapsulation, Chip, Easy for integration, Polarized | - | Epoxy molded encapsulation, Chip, Easy for integration, Polarized - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 1.5μF ±20% 25V GCA30-25V1.5μF-M 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Silver case encapsulation , Epoxy end-filled,Tubular, Axial-lead,With insulation sleeve, Heteropolarity | - | Silver case encapsulation , Epoxy end-filled,Tubular, Axial-lead,With insulation sleeve, Heteropolarity - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 3.3μF ±20% 50.0V CA45H-D050M335AT 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Epoxy molded encapsulation, Chip, Easy for integration, Polarized | - | Epoxy molded encapsulation, Chip, Easy for integration, Polarized - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 1.5μF ±20% 25.0V CA45H-B025M155AT 国产 | 非PIN TO PIN | 相似度99% | Xiangyi(湘怡中元) | Epoxy molded encapsulation, Chip, Easy for integration, Polarized | - | Epoxy molded encapsulation, Chip, Easy for integration, Polarized - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 6.8μF ±20% 25V GCA30-25V6.8μF-M 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Silver case encapsulation , Epoxy end-filled,Tubular, Axial-lead,With insulation sleeve, Heteropolarity | - | Silver case encapsulation , Epoxy end-filled,Tubular, Axial-lead,With insulation sleeve, Heteropolarity - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 0.47μF ±20% 25.0V CA-25V0.47μF-M 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Metal case encapsulation, Hermitically-sealed, Tubular, Axial-lead, With Insulation Sleeve,With Insulation Sleeve,Heteropolarity | - | Metal case encapsulation, Hermitically-sealed, Tubular, Axial-lead, With Insulation Sleeve,With Insulation Sleeve,Heteropolarity - | - | 0 pcs | - | - | 0 pcs - - | | |
温馨提示:图片仅供参考，请查阅数据手册 | 33.0μF ±20% 6.3V CA45H-C6R3M336AT 国产 | 非PIN TO PIN | 相似度82% | Xiangyi(湘怡中元) | Epoxy molded encapsulation, Chip, Easy for integration, Polarized | - | Epoxy molded encapsulation, Chip, Easy for integration, Polarized - | - | 0 pcs | - | - | 0 pcs - - | | |
元器件分类 
易采购
替代Bom
AI大数据平台
供应商入驻
成品拆解
行业快报
